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Solder plating - メーカー・企業と製品の一覧

Solder platingの製品一覧

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Lead-free low melting point solder plating

Lead-free low melting point solder plating

Low-temperature mounting is possible for weak heat-resistant materials such as PET.

By using low melting point solder, energy consumption during reflow can be reduced, thereby lowering environmental impact. 【Sn-Bi Alloy Plating】DAINTINGOOD 503 - Low melting point (approximately 140°C) Sn-Bi alloy. - The Bi content (20-60 wt%) can be controlled by changing the usage conditions. - Plating can be performed with relatively high current efficiency. 【Sn-In Alloy Plating】Dainting Alloy I - Low melting point (approximately 120°C) Sn-In alloy. - A white, non-glossy film with an In content of 50-70% can be obtained. - Plating can be performed with relatively high current efficiency.

  • Chemicals
  • Solder

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Lead-free low melting point solder plating

Lead-free low melting point solder plating

Low-temperature mounting on weak heat-resistant materials such as PET is possible.

By using low melting point solder, energy consumption during reflow can be reduced, thereby lowering environmental impact. Plating allows for implementation on patterns and small components. 【Sn-Bi Alloy Plating】DAINTINGOOD 503 - Low melting point (approximately 140°C) Sn-Bi alloy. - By changing the usage conditions, the Bi content (20-60 wt%) can be controlled. - Plating can be performed with relatively high current efficiency. 【Sn-In Alloy Plating】DAINTINGOOD 511 - Low melting point (approximately 120°C) Sn-In alloy. - A white, non-glossy film with an In content of 50-70% can be obtained. - Plating can be performed with relatively high current efficiency.

  • Chemicals
  • Solder
  • Other electronic parts

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Solder plating (6:4)

Solder plating (6:4)

Good acid resistance! It is also highly solderable, making it suitable for soldering applications.

"Solder plating" is a technique that forms a solder coating on the surface of steel materials by immersing them in a solder solution and passing an electric current through it. Our solder plating is known as 6:4 solder (eutectic solder), which has a low melting point (approximately 183°C) and high solderability, making it suitable for soldering applications. Additionally, it has a Vickers hardness of 5 to 15, which is relatively soft, and it excels in whisker growth suppression and corrosion resistance, making it used for plating in battery components and electronic parts. 【Features】 - The ratio of tin to lead is 6:4 - Compatible with various products from terminals to copper bars - High corrosion resistance, used in battery terminal components, etc. - As an alloy plating, it suppresses the generation of whiskers that can cause short circuits - Lead in batteries is considered an exempt component under the European ELV directive *For more details, please refer to the PDF materials or feel free to contact us.

  • Surface treatment contract service
  • Processing Contract

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Low melting point solder plating (melting point 60~110℃)

Low melting point solder plating (melting point 60~110℃)

Developed a solder plating that can be adjusted to a melting point of 60 to 110℃!!

Low heat-resistant materials have issues of "distortion, misalignment, and reduced characteristics" due to the heat during implementation (reflow). With the newly developed low-melting-point solder plating, the melting point can be selected in the low temperature range of 60 to 110°C to match the heat resistance of the target materials. This allows for implementation without damage or alteration. <Examples of applications> - PZT (piezoelectric elements) - CdTe (cadmium telluride) - Resin materials (such as PET) - micro LED (LTPS) etc... for implementation solder.

  • Wafer
  • Sensors
  • EMS

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